Thie Ph.D. has 30 years of experience in thedesign, development and manufacture of over 350 different high-technologyanalog and digital products that use IC and MEMS and their packages in new andinnovative ways for automotive, medical, industrial and commercialapplications.  He has proven ability toassist businesses through the strategic timing of technology investments andproduct development and manufacturing in international and cross-functionalteams.  Dr. Spangler has excellent oraland written communication skills along with a deep knowledge of patent andintellectual property issues.  He is theinventor or co-inventor on nine U.S. and international patents.  He provides IP and Expert Witness serviceswith successful trial experience at the International Trade Commission.  He is the named Inventor of eight US Patentswith other applications pending.  He is well-published in his core areas of expertise outlined below.

• Analog Mixed-Signal circuitsand Technology

• Automotive accelerometers, and other safety-related components

• DNA Analysis chips

• Flash memory card fabrication

• IC packagingtechnology

• Medical sensors, neurostimulation devices

• MEMS fabricationtechnologies

• MEMS Inertial, Seismic, and Pressure Sensors

• MEMS optical and RF switches

• MEMS packagingtechnologies

• MEMS sensors andactuators

• Micro fuel cells, print heads, viscosity sensors

• Micro Optical andfluidic packaging

• Microfluidic Devices

• Microwave, Power and SOI Transistors

• Ultra-High Resolution Optical Displays

• Visible light, IR and X-rayimagers

Education:

Litigation Support:

10 Patent Infringement matters, including two (2) before the ITC