This expert has his doctorate from the world's top research university with over 25 years of experience in semiconductor device fabrication and manufacturing. He has several patents related to laser processing of application specific circuitry and redundancy in DRAM and SRAM. One patent is implemented in an exclusively licensed DRAM in nearly every Apple product. He has been teaching physics of failure and device reliability for the past 20 years. He founded 2 start-up companies licensing his IP and has published over 120 papers and conference publications on device reliability, advanced packaging and laser processing of semiconductor devices. He has extensive expert witness work and has stood as a technical expert in trial as well as dozens of depositions and testimonials and he is very efficient at writing expert reports. 

This expert is a professor teaching VLSI design and processing at major Universities since 1995. He regularly consults with high tech companies and supervises projects related to ASIC, FPGA design, testing and Failure Analysis. He understands the device physics and teaches them in his graduate and undergraduate classes. His Ph.D students continue to have a strong impact on the semiconductor industry as they have prominent positions in large and important semiconductor fabrication and design companies, including Intel &l Apple and others. He has been working with industry around the globe and has made innovations with his physics of failure approach to reliability prediction. He works with packaging technologies as well. His students continue his legacy by studying circuit integrity and reliability of systems based on solder joint reliability and multiple failure mechanisms in the silicon devices themselves.

§  Advanced Packaging of Electronic Devices

§  Analog & Mixed Signal Device Reliability

§  Electronic System Lifetime Prediction

§  Failure Analysis of Electronic Circuits & Systems

§  Fuse Processing for Redundancy & Memory Repair

§  Gate Oxide Integrity of  Ultra-Thin Gate Dielectrics

§  Hot Carrier Degradation of Nanometer Scale Devices

§  Laser Processing of Semiconductor Devices & Wafers

§  Materials Processing for Advanced SemiconductorDevices

§  Materials Processing for MEMS Applications

§  Modeling & Prediction of Electronic SystemsReliability

§  Multiple Failure Mechanism Modeling

§  Physics of Failure of Advanced Devices & Systemson a Chip

§  Redundancy & Repair of Semiconductor Devices

§  Reliability Considerations for Electronic Circuits andSystems

§  Semiconductor Device Processing Technologies

§  Solder Joint Integrity

§  Thermal Fatigue of Electronic Circuit Boards

• Ph.D., Electrical Engineering and Computer Science (Massachusetts Institute of Technology)
• E.E., Electrical Engineering (Massachusetts Institute of Technology)
• M.S., Electrical Engineering and Computer Science (Massachusetts Institute of Technology)
• B.S., Electrical Engineering, Summa Cum Laude (Union College, New York)
  
  Litigation Support Experience:
  
  
• Testifying Expert Witness in several Patent Infringement Matters