From 1970 through 2005, this Ph.D. was on the faculty at RPI, a Professor in the Electrical, Computer, and Systems Engineering Department with teaching and research activities in the areas of semiconductor devices, microwave/RF circuit design and integrated circuit (IC) interconnect technology.  He has published more than 400 refereed papers in journals and international conference digests, presented more than thirty invited talks at professional conferences and is a Fellow of the IEEE for contributions in microwave semiconductor technology.  He has coauthored three books on IC  interconnects, including the first books focused on chemical-mechanical polishing (CMP) and copper metallization, and co-edited a recent book on three-dimensional (3D) IC processing.  Recent research activities include 3D IC platforms (both process technology and circuit design), copper damascene patterning, CMP, thermophotovoltaic (TPV) devices, silicon carbide (SiC) power devices and material characterization using microwave photoconductivity decay (M-PCD).

From 1962 to 1966 he was at a major electronics company, working on microwave components for phased array radars.  From 1981 to 1983 he was Program Director at the National Science Foundation (NSF), with responsibility for university grants in solid state and microstructures engineering and the National Nanofabrication Facility (NNF).  From 1989 to 1994 he was the Director of the Center for Integrated Electronics and responsible for the Microfabrication Clean Room and research programs in IC interconnects.  He has served on the University Advisory Boards at both SEMATECH and the SRC and received the RPI William H. Wiley Distinguished Faculty Award in 2000.

As Professor Emeritus since 2006, his research has emphasized unique IC designs enabled by 3D integration.  He serves as a consultant and expert witness, in areas of integrated circuit processing, semiconductor devices and IC component design.  He has recently testified before the International Trade Commission (ITC) and has been deposed for both plaintiffs and defendants.

Electronics and Electrical Engineering

• RF Design
• RF Technology

Microelectronics Technology

• Integrated Circuit (IC) Manufacturing
• Interconnects
• Semiconductor Physics and Technology
• Wafer Fabrication Processes

Monolithic IC Component Design

• Microwave Monolithic IC (MMIC) Switches and Phase Shifters
• Point-of-Load (PoL) DC-DC Converters (buck and resonant)
• Analog-to-Digital Converters (ADCs), both sigma-delta and pipelined
• Design Partitioning for 3D Integration (with through-silicon vias (TSVs)

Semiconductor and Microchip Fabrication

• Wafer Manufacturing
• Chemical-Mechanical Polishing and Planarization (CMP)
• Wafer Bonding
• Wafer Thinning

Semiconductor Devices (design, modeling, fabrication and characterization)

• RF/Microwave Control Devices (PIN diodes, MESFETs and HEMTs)
• Wide Bandgap Power Devices (SiC and GaN)
• Thermophotovoltaic (TPV) Devices (GaSb, GaInSb and GaInAsSb)
• SiGe and III-V Heterojunction Devices (HBTs and HEMTs)
• Radiation Effects (neutrons and transient ionizing) 
• Microwave Photoconductivity Decay (M-PCD_to Characterize Recombination Mechanisms

Semiconductor/IC Manufacturing Technology (wafer-level, both front and back end processing)

• Chemical-Mechanical Polishing and Planarization (CMP) - metals, dielectrics and semiconductors
• Copper Damascene Patterning
• Wafer Bonding, Thinning and Planarization for 3D Integration
• Compound Semiconductor Processing

• Ph.D., Electrophysics
• M.S., Electrical Engineering
• B.S., Electrical Engineering

Expert Witness Services;

• Deposition
• Expert Witness Reports
• Intellectual Property
• Patent Analysis
• Patent Portfolio Review
• Prior Art Research
• Technical Consultant