This Ph.D. has 40 years of experience in the development, and practical application of techniques for the analysis of surfaces, thin films, and very small quantities of materials.  An early pioneer of Electron Spectroscopy, he spent many years applying electron spectroscopy, microscopy, and other surface techniques to study molecules absorbed at metal and semiconductor surfaces. 

He has worked in university environments and, for more than 25 years, in high technology industry (Bell Labs; IBM Research; Applied Materials).  Since 1993 he has provided independent services to industry and to intellectual property law firms, as a consultant, contractor, and an educator. 

• Auger Electron Spectroscopy, AES
• Atomic Force Microscopy, AFM
• Cross-sectioned analysis by SEM / EDX, and by TEM / STEM / EELS / EDX
• Fourier Transform Infra-Red Spectroscopy
• Gas Phase Chromatography / Mass Spectroscopy, GC-MS, for organic contaminants
• Hydrogen Forward Scattering, HFS
• Light scattering for particle detection on Si wafers
• Medium Energy Ion Scattering, MEIS
• Raman Spectroscopy
• Rutherford Backscattering, RBS
• SEM / AES for particle analysis on Si wafers
• SEM / EDX for particle analysis on Si wafers
• Scanning Electron Microscopy, SEM, with Energy Dispersion X-Ray Analysis, EDS (or EDX)
• Secondary Ion Mass Spectroscopy, SIMS
• Ultraviolet Photoelectron Spectroscopy, UPS
• X-Ray Diffraction for thin film phase composition
• X-Ray Photoelectron Spectroscopy, XPS (or ESCA)